VEIR Raises $110 Million Series C to Accelerate Commercialization of Superconducting Power Delivery Technology for AI Data Centers

VEIR Raises $110 Million Series C to Accelerate Commercialization of Superconducting Power Delivery Technology for AI Data Centers

WOBURN, Mass.--(BUSINESS WIRE)--VEIR, a U.S.-based designer and manufacturer of superconducting power delivery systems for AI data centers, today announced the closing of an oversubscribed $110 million Series C financing round co-led by Matter Venture Partners and Tyche Partners, with participation from LG Technology Ventures, Gates Frontier, Sabanci Climate Ventures, and Hui Capital. The round also included participation from existing investors such as Engine Ventures, Galvanize Climate Solutions, Piva Capital, Congruent Ventures, VXI Capital, among others, and brings the company’s total capital raised to $225 million.